- 前半段為文章的英文版本 (The first half is the English version)
- 後半段為中文版本 (The second half is the Mandarin version)
In the semiconductor industry critical to advancing AI technology, memory is one of the pivotal components alongside well-known players like GPU supplier Nvidia and chip manufacturing powerhouse TSMC. South Korea has long dominated the memory semiconductor market, but recent years have seen China rise rapidly, presenting formidable competition to South Korean companies.
China’s Rapid Ascension in the Memory Market
Chinese memory chipmakers, such as CXMT (Changxin Memory Technologies), have demonstrated remarkable growth in recent years. For instance, CXMT’s share of the global DRAM market rose from 4% in 2022 to 11% in 2024, with projections for further growth reaching 16% by 2025. Additionally, since surpassing South Korea in memory chip market share (27.2%) in 2019, China has held the top spot globally for four consecutive years. These numbers highlight China’s growing competitive edge in memory technology, creating unprecedented challenges for South Korean leaders in the field.
High-End Memory Technology Race
Despite China’s advancements, South Korea maintains a notable lead in the high-bandwidth memory (HBM) market—a sector crucial for AI computing. South Korean giants SK Hynix and Samsung Electronics remain dominant, with SK Hynix capturing over 90% of the HBM market share in the first half of 2024, earning it the title “King of AI Memory.”
Meanwhile, Chinese companies, though rapidly improving in the memory chip industry, lag behind in HBM technology. For example, CXMT has been working on developing HBM2 solutions but still trails behind South Korea’s cutting-edge products in performance and manufacturing processes. However, China is not standing still. Companies such as Huawei are actively advancing HBM technology. Huawei, for instance, is partnering with memory manufacturer Wuhan Xinxin (XMC) to produce HBM and collaborating with advanced packaging companies like JCET and TFME to enhance R&D efforts in this area.
Low-Cost Strategy Shaking the Market
While HBM technology remains a work in progress, Chinese companies are leveraging their signature competitiveness in the general-purpose memory market with aggressive pricing strategies. For instance, Huawei recently launched a 1TB SSD in the South Korean market for just 47,500 KRW (approximately $32 USD). Its highly competitive pricing undercuts rivals, showcasing the ambition and determination of Chinese semiconductor companies to disrupt the memory market.
Taiwan’s Role in Bolstering South Korea’s Leadership
Responding to growing pressure from China, South Korean memory giants are turning to Taiwan’s AI supply chain for collaboration to fortify their position in the HBM market. SK Hynix has announced plans to partner with TSMC to produce next-generation HBM4 chips by 2026, addressing the rising demand for advanced AI computing. Similarly, Samsung Electronics is seeking collaborations with Taiwanese companies to enhance its competitiveness in the HBM sector.
Historically, Taiwan and South Korea have been fierce competitors in semiconductors. However, the combined forces of the AI boom and China’s rise have created new opportunities for collaboration, leveraging their complementary strengths. By uniting South Korea’s expertise in memory technology with Taiwan’s capabilities in wafer manufacturing and AI supply chains, these partnerships are not only breaking technological barriers but also setting a new benchmark for international collaboration.
Trends and Prospects
The global semiconductor landscape is evolving rapidly, making it increasingly difficult for organizations or nations to stand alone. Pooling resources and developing cross-border partnerships have become vital strategies for tackling competition. The cooperation between Taiwan and South Korea exemplifies the potential of collective innovation and sets a model for others in the industry.
This fierce competition in the memory market marks just the beginning. Underpinned by a new wave of technological advancements and AI-driven demand, the rivalry will undoubtedly intensify. The semiconductor world is on the cusp of dynamic changes, and all eyes are on this highly competitive and opportunity-laden sector.
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在推動 AI 技術至關重要的半導體產業中，除了我們熟悉的 GPU 供應商 Nvidia 及高階晶片製造巨頭台積電 (TSMC) 外，記憶體同樣是不可或缺的核心環節。而提到記憶體半導體，南韓一直以領先姿態占據全球市場。但近年來，中國大陸以驚人的速度崛起，成為南韓企業不可忽視的強勁對手。
中國在記憶體市場的快速崛起
中國大陸記憶體晶片企業如長鑫存儲（CXMT），近年來在 DRAM 市場的全球產能表現搶眼，其市場占比從 2022 年的 4% 提升至 2024 年的 11%，並預計到 2025 年將進一步攀升至 16%。此外，自 2019 年開始，中國大陸的記憶體晶片市佔率 (27.2%) 超越南韓後，已連續四年穩居全球首位。這些數據說明，中國在記憶體領域的競爭力正以高速增長，對南韓龍頭企業帶來前所未有的壓力。
高階記憶體技術的較量
然而，在高頻寬記憶體（HBM）這一聚焦 AI 運算的高階市場領域，南韓依然保持著明顯的技術優勢。南韓的 SK 海力士（SK Hynix）與三星電子（Samsung Electronics）仍是 HBM 市場的主角，其中 SK 海力士更是以 2024 年上半年超過 90% 的市佔率被譽為「AI 記憶體之王」。
反觀中國大陸，雖然記憶體晶片產業日益強大，但在 HBM 技術上與南韓尚有一定差距。以長鑫存儲（CXMT）為例，該公司正在努力開發新的 HBM2 技術，但在性能及製程上仍落後於南韓主導的頂尖產品。不過，中國大陸並未止步，許多公司如長江存儲、華為等正積極投入 HBM 技術的研發。例如，華為計劃與記憶體廠商武漢新芯（XMC）合作生產 HBM，並與長電科技、通富微電子等尖端封裝技術公司聯手，共同推動這一領域的進步。
高性價比策略挑戰市場
雖然 HBM 尚無法追趕，但中國大陸在標準記憶體領域利用其一貫的高性價比策略對全球市場進行衝擊。例如，華為推出的一款 1TB 固態硬碟（SSD）在南韓的售價僅為 47,500 韓元（約 32 美元），這種極具吸引力的價格策略將可能壓制競爭對手，彰顯出中國企業在記憶體市場內的強大競爭力與企圖心。
台灣角色：助力南韓維持領先地位
面對來自中國大陸的壓力，南韓記憶體產業正積極與台灣 AI 供應鏈建立更緊密的合作來鞏固自身優勢。SK 海力士已宣布將於 2026 年攜手台積電推出下一代 HBM4 晶片，共同應對 AI 計算需求的快速增加。三星電子也正努力尋求與台灣相關企業合作，提升其在 HBM 市場的競爭力。
台韓兩國過往在半導體領域的關係經常是激烈競爭，但在 AI 浪潮與中國崛起的雙重推動下，雙方產業的高度互補性為合作提供了新的契機。通過南韓在記憶體技術上的專長與台灣在晶圓製造及 AI 供應鏈的實力，台韓合作不僅突破了技術瓶頸，也樹立了國際合作的新典範。
整體趨勢與展望
全球半導體市場正快速變化，個別企業或國家想要單打獨鬥早已難以為繼。團結資源、跨國協作成為應對競爭壓力的有效策略。台韓合作的模式正展示了集體智慧與技術深化的力量，也為產業未來的發展提供了一個值得借鑒的方向。在新一輪科技革命與 AI 驅動下，這場記憶體市場的競爭勢必更加激烈，我們將持續關注這個充滿動態與機遇的領域。